Introduction

A 2019 Snapdragon flagship going up against two nearly identical modern MediaTek mid-rangers is another reminder that chip age and chip performance don’t always move together. This Dimensity 7360 vs Snapdragon 855 Plus vs Dimensity 7300 comparison uses verified NanoReview specification and benchmark data to explain how these three chips perform in CPU work, gaming, camera processing, and connectivity, and which one actually offers the strongest package.

1. Processor Overview

The Dimensity 7360, announced September 2025, is an 8-core chip built on TSMC’s 4nm process, pairing 4x Cortex-A78 cores at 2.5GHz with 4x Cortex-A55 efficiency cores at 2.0GHz, alongside a Mali-G615 MP2 GPU.

The Snapdragon 855 Plus, announced July 2019 and by far the oldest chip in this comparison, uses an 8-core layout on Qualcomm’s older 7nm process: 1x Cortex-A76 (Kryo 485 Gold) at 2.96GHz, 3x Cortex-A76 at 2.42GHz, and 4x Cortex-A55 (Kryo 485 Silver) at 1.8GHz, paired with an Adreno 640 GPU, reflecting its genuine flagship-class origins in the OnePlus 7T.

The Dimensity 7300, announced June 2024, shares an essentially identical specification sheet with the Dimensity 7360: the same 4x Cortex-A78 at 2.5GHz plus 4x Cortex-A55 at 2.0GHz layout, the same Mali-G615 MP2 GPU, and matching TDP, memory, and connectivity figures.

Despite being announced six years before the Dimensity 7360, the Snapdragon 855 Plus’s higher-clocked Cortex-A76 prime core and larger Adreno 640 GPU make it a genuine contender in several of the benchmarks below.

2. CPU Architecture & Processing Power

All three chips use the ARMv8.2-A instruction set. The Snapdragon 855 Plus uses a 1+3+4 clock tiering with its Cortex-A76 cores, while both Dimensity chips use a flat 4+4 split with Cortex-A78 cores, a newer core design than the Snapdragon chip’s Cortex-A76.

In Geekbench 6 single-core, the Snapdragon 855 Plus edges out both Dimensity chips, scoring 1031 versus 1025 for the Dimensity 7360 (about 0.6% lower) and 1011 for the Dimensity 7300 (about 1.9% lower than the Snapdragon 855 Plus). The gap here is minimal, and the Dimensity 7360 actually leads the Dimensity 7300 by about 1.4%.

Multi-core is similarly close across all three: the Dimensity 7360 leads narrowly with 2882, just ahead of the Snapdragon 855 Plus (2864, about 0.6% lower) and the Dimensity 7300 (2813, about 2.5% lower than the Dimensity 7360). Despite its age, the Snapdragon 855 Plus’s multi-core result remains highly competitive against both newer chips.

3. GPU & Gaming Performance

The Snapdragon 855 Plus’s Adreno 640 has the highest theoretical FLOPS rating by a wide margin at 1036.8 Gigaflops, nearly double either Dimensity chip’s Mali-G615 MP2, rated at 536.1 Gigaflops.

Geekbench 6 GPU Compute confirms this theoretical advantage translates into real performance: the Snapdragon 855 Plus leads clearly at 2934, about 13.9% higher than the Dimensity 7360 (2525) and about 17.0% higher than the Dimensity 7300 (2507). Between the two Dimensity chips, the Dimensity 7360 leads the Dimensity 7300 narrowly at about 0.7%.

3DMark data is only disclosed for the two Dimensity chips, which are nearly tied in Steel Nomad Light (343 for the Dimensity 7360, 346 for the Dimensity 7300); no 3DMark figure is available for the Snapdragon 855 Plus. Uniquely, the Snapdragon 855 Plus has real-world gaming FPS data at Ultra settings, showing results like Call of Duty: Mobile at 58 FPS, World of Tanks Blitz at 60 FPS, and Mobile Legends: Bang Bang at 58 FPS; no equivalent gaming FPS table is supplied for either Dimensity chip. NanoReview’s own Gaming Performance sub-score also favors the Snapdragon 855 Plus (15) over both Dimensity chips (13 each).

4. Manufacturing Process & Efficiency

Both Dimensity chips share the newer TSMC 4nm process, while the Snapdragon 855 Plus uses an older TSMC 7nm node. TDP favors the Dimensity chips clearly: both are disclosed at 4W, versus the Snapdragon 855 Plus’s 6W.

NanoReview’s battery-life sub-scores confirm this efficiency gap: both Dimensity chips score 91, notably higher than the Snapdragon 855 Plus’s 85. Despite this, NanoReview’s overall composite score slightly favors the Snapdragon 855 Plus (39) over both Dimensity chips (38 each), reflecting its stronger CPU and gaming sub-scores offsetting its weaker battery-life rating.

5. RAM, Memory & Storage Support

Both Dimensity chips use LPDDR5 memory at 3200MHz, delivering 25.6Gb/s bandwidth. The Snapdragon 855 Plus uses the older LPDDR4X standard at 2133MHz, but with a wider 4×16-bit bus that delivers slightly higher bandwidth at 34.13Gb/s. All three support up to 16GB RAM.

Storage support favors the Dimensity chips, which both support UFS 2.2 and UFS 3.1. The Snapdragon 855 Plus supports the older UFS 3.0 standard only.

6. AI & NPU Capabilities

Both Dimensity chips use a named MediaTek APU 655, and the Snapdragon 855 Plus uses a named Hexagon 690 NPU. None of the three has a disclosed TOPS figure in the supplied data, so no numeric AI performance ranking can be established, though all three confirm dedicated AI hardware is present.

7. ISP, Camera & Video Capabilities

Camera and video capability clearly favor the Snapdragon 855 Plus. It supports a maximum single sensor configuration of 192MP plus 2x 22MP, and its video ceiling is far ahead of both Dimensity chips: 4K capture at 120FPS, with playback reaching 8K at 30FPS and 4K at 120FPS. Both Dimensity chips are limited to a single 200MP sensor with no secondary sensor support disclosed, and 4K at 30FPS for both capture and playback, a considerably lower video ceiling.

Codec support tells a slightly different story: the Snapdragon 855 Plus adds VP8 alongside H.264, H.265, and VP9, while both Dimensity chips support H.264, H.265, and VP9 only. None of the three supports AV1.

8. Display Support

The Snapdragon 855 Plus supports the highest maximum display resolution at 3840 x 2160, well ahead of both Dimensity chips’ shared 2520 x 1080 ceiling, reflecting its original flagship-class positioning.

9. Modem, 5G & Connectivity

The Snapdragon 855 Plus, via its X24 LTE plus X50 5G modem combination, discloses both a 5G download speed of up to 5000 Mbps and an upload speed of 1240 Mbps. Both Dimensity chips are limited to a lower disclosed download figure of 3270 Mbps, with no upload speed supplied for either.

Wi-Fi 6 is common to all three. Bluetooth clearly favors the Dimensity chips, both at the newer 5.4 version, versus the Snapdragon 855 Plus’s much older 5.0. GNSS support is broadest on the Snapdragon 855 Plus, which adds QZSS and SBAS alongside GPS, GLONASS, Beidou, and Galileo, though it notably omits NAVIC, which both Dimensity chips include. These are theoretical maximums; real-world network speeds depend on carrier infrastructure and will not always reach these ceilings.

10. Benchmark Comparison

All benchmark figures below use AnTuTu 11 and Geekbench 6, so comparisons are apples-to-apples.

AnTuTu 11 Total:

• Dimensity 7360: 925,409
• Dimensity 7300: 879,714 (Dimensity 7360 leads by about 5.2%)
• Snapdragon 855 Plus: 859,084 (Dimensity 7360 leads by about 7.7%, and the Dimensity 7300 leads by about 2.4%)

Geekbench 6 Single-Core: Snapdragon 855 Plus leads narrowly with 1031, ahead of the Dimensity 7360 (1025, about 0.6% lower) and Dimensity 7300 (1011, about 1.9% lower than the Snapdragon 855 Plus).

Geekbench 6 Multi-Core: Dimensity 7360 leads narrowly with 2882, ahead of the Snapdragon 855 Plus (2864, about 0.6% lower) and Dimensity 7300 (2813, about 2.5% lower).

Geekbench 6 GPU Compute: Snapdragon 855 Plus leads clearly at 2934, about 13.9% higher than the Dimensity 7360 (2525) and about 17.0% higher than the Dimensity 7300 (2507).

3DMark Steel Nomad Light: The Dimensity 7300 (346) and Dimensity 7360 (343) are nearly identical; not disclosed for the Snapdragon 855 Plus.

PCMark 3.0: Only disclosed for the Dimensity 7300 (13,626) and Dimensity 7360 (10,678, about 21.6% lower); not disclosed for the Snapdragon 855 Plus.

The overall picture is close but leans toward the Snapdragon 855 Plus on GPU-related benchmarks, while the Dimensity 7360 wins the composite AnTuTu score and multi-core by narrow margins.

11. Real-World Performance

Everyday users should see nearly identical single-core responsiveness across all three, with the Snapdragon 855 Plus holding a very slight edge despite its age.

Multitaskers get essentially interchangeable multi-core performance from the Dimensity 7360 and Snapdragon 855 Plus, both well ahead of the Dimensity 7300 by a small margin.

Gamers get the clearest advantage from the Snapdragon 855 Plus, which leads GPU Compute by a wide margin and is the only chip with disclosed real-world gaming FPS data.

Content creators benefit dramatically from the Snapdragon 855 Plus’s video and camera capabilities, including 8K playback and 4K/120FPS capture, far beyond either Dimensity chip’s 4K/30FPS ceiling.

AI users cannot be meaningfully differentiated here, since none of the three chips has a disclosed NPU TOPS figure.

Connectivity-focused users get a faster disclosed 5G download and upload speed from the Snapdragon 855 Plus, though both Dimensity chips offer newer Bluetooth and NAVIC support it lacks.

Battery-conscious users should clearly favor either Dimensity chip, both with a meaningfully higher NanoReview battery-life score than the Snapdragon 855 Plus.

12. Strengths & Weaknesses

MediaTek Dimensity 7360

• Strengths: Highest AnTuTu 11 total score of the three; leads Geekbench multi-core narrowly; tied for the lowest TDP and highest battery-life sub-score; newer Bluetooth version.
• Weaknesses: Notably lower PCMark score than its near-identical sibling, the Dimensity 7300; trails the Snapdragon 855 Plus by nearly 14% in GPU Compute; far lower video and display ceiling than the Snapdragon 855 Plus.

Qualcomm Snapdragon 855 Plus

• Strengths: Leads Geekbench single-core and GPU Compute; only chip with disclosed real-world gaming FPS data; by far the widest video ceiling (8K playback, 4K/120FPS capture) and highest display resolution; fastest disclosed 5G speeds; highest NanoReview composite score (39).
• Weaknesses: Lowest AnTuTu 11 total score of the three despite genuine flagship-class hardware; lowest NanoReview battery-life sub-score (85); oldest Bluetooth version (5.0); no NAVIC support; highest TDP (6W).

MediaTek Dimensity 7300

• Strengths: Highest PCMark score of the three by a wide margin; tied for the lowest TDP and highest battery-life sub-score; nearly matches the Dimensity 7360 across most benchmarks.
• Weaknesses: Lowest AnTuTu 11 total score among the two Dimensity chips; lowest Geekbench single-core, multi-core, and GPU Compute scores of the three; same limited video and camera ceiling as the Dimensity 7360.

13. Best Processor For Different Users

• Best for Gaming: Qualcomm Snapdragon 855 Plus
• Best for AI: Not determinable from supplied data
• Best for Efficiency: MediaTek Dimensity 7360 and Dimensity 7300 (tied)
• Best for Camera Processing: Qualcomm Snapdragon 855 Plus
• Best for Connectivity: Qualcomm Snapdragon 855 Plus (speed), MediaTek chips (Bluetooth and NAVIC)
• Best for Balanced Performance: Qualcomm Snapdragon 855 Plus

Final Verdict

This Dimensity 7360 vs Snapdragon 855 Plus vs Dimensity 7300 comparison shows a genuinely competitive six-year-old flagship chip against two nearly identical modern mid-rangers. The Primary Processor, the Dimensity 7360, wins the composite AnTuTu score, but the supplied data does not support calling it the strongest chip overall.

Final Verdict

1. Qualcomm Snapdragon 855 Plus — Best Overall Despite being announced six years before the Dimensity 7360, it leads Geekbench single-core and GPU Compute, offers by far the best video, camera, and display specifications, the fastest disclosed 5G speeds, and the highest NanoReview composite score, making it the most complete performer even though it posts the lowest AnTuTu total score.

2. MediaTek Dimensity 7360 — Best For AnTuTu Score and Efficiency It leads the composite AnTuTu 11 score and Geekbench multi-core narrowly, and offers the lowest TDP and highest battery-life score tied with the Dimensity 7300, but trails the Snapdragon 855 Plus clearly in GPU Compute and video capability.

3. MediaTek Dimensity 7300 — Best For PCMark It leads the everyday-workload PCMark test by a wide margin over its near-twin, the Dimensity 7360, but posts the lowest AnTuTu total and Geekbench scores of the three, making it the least compelling of the group on balance.

Best for Gaming: Qualcomm Snapdragon 855 Plus Best for AI: Not determinable from supplied data Best for Efficiency: MediaTek Dimensity 7360 and Dimensity 7300 Best Balanced Choice: Qualcomm Snapdragon 855 Plus

Bottom Line: The AnTuTu 11 total score favors the Dimensity 7360, which leads the Snapdragon 855 Plus by roughly 7.7% and the Dimensity 7300 by roughly 5.2%. But on nearly every other directly comparable benchmark, the six-year-old Snapdragon 855 Plus holds its own or wins outright, particularly in GPU Compute, video capability, and real-world gaming data. Buyers chasing the highest AnTuTu number should note the Dimensity 7360, but those wanting the strongest all-round chip based on the fuller benchmark picture, especially for gaming and video, should weigh the Snapdragon 855 Plus’s genuine strengths against its older Bluetooth, missing NAVIC, and lower battery-life score.